Double Chamber Vacuum Brazing/Sealing Furnace for Semi-Conductor

Product Details
Customization: Available
Certification: CE, ISO
Place Style: Horizontal
Diamond Member Since 2016

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  • Double Chamber Vacuum Brazing/Sealing Furnace for Semi-Conductor
  • Double Chamber Vacuum Brazing/Sealing Furnace for Semi-Conductor
  • Double Chamber Vacuum Brazing/Sealing Furnace for Semi-Conductor
  • Double Chamber Vacuum Brazing/Sealing Furnace for Semi-Conductor
  • Double Chamber Vacuum Brazing/Sealing Furnace for Semi-Conductor
  • Double Chamber Vacuum Brazing/Sealing Furnace for Semi-Conductor
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Basic Info.

Model NO.
RNZ01
Type
Vacuum Sealing Furnace
Usage
Semi-Conductor
Fuel
Electric
Control Mode of Precessing Temperature
Direct Heating
Max Processing Temperature
850 Degree
Operating Vacuum Level
<50 PA
Vacuum Pumping Spead
4.2L/S
Type of Protective Gas
1
Full Load Angle of Lid
150 Degree
Overall Weight
550kgs
Transport Package
Wooden Case
Specification
1300x810x1400
Trademark
OEM ODM
Origin
China
HS Code
848640290
Production Capacity
200

Product Description

RNZ01-D Vacuum Sealing Furnace

The vacuum brazing/sealing furnace is a specialized equipment for high-quality processing of electronic components, and the excellent processing performance is achieved and guaranteed by a series of supporting systems. The cooling water system and internally cooled electrodes make the vacuum brazing/sealing furnace cool down rapidly. In addition to the cooling water unit, because the high temperature of the vacuum brazing/sealing furnace is realized through high discharge current of the electrodes, the internally cooled electrodes can dissipate a large amount of heat quickly under power-off conditions, meanwhile, the electrodes are protected from oxidation at high temperature. The lid switch device is a lever type trapezoidal threaded structure to ensure the sealing of the vacuum and the positive pressure of 3 kg/cM2, inside the chamber. It is also easy to open and close frequently during the production. The vacuum suction system, protective gas supply system and control system are designed to make sure the workpieces are processed with high quality and no oxidation. When the production process starts, the microcomputer controller sends a signal to start the vacuum pump to exhaust the air out of the furnace which may affect the processing quality in the vacuum furnace, and then start the heating process under vacuum conditions. During the process, the microcomputer controller continuously changes the vacuum degree and volume of the protective gas according to different requirements for the processing technology of different products to ensure the processing quality. The protective gas control system can automatically turn on or off the supply of protective gas according to process requirements at any time, control the concentration of the mixed protective gases inside the furnace, control the volume and time of input of protective gases in sequence, re-vacuuming and processing pressure, ensuring the highest internal pressure and pressure safety of the vacuum furnace system. Considering the different processes of different products, the programs can be customized, controlled and changed. The main functions rely on the human-machine interaction via a programmable logic controller (PLC) and a color touch screen. 12 frequently used programs can be preset for the machine and each program is further divided into 48 procedures according to different processing requirements. Users can choose one of the programs as needed.

Once the process is started, the programmable logic controller will control each step in the whole process automatically and display the processing information on the color touch screen. In case of an error in the process, the system will generate an alarm or end the program automatically. Because the processing quality of the workpiece is affected by various factors such as production conditions, processing technology and geometric dimension of products, it is important to set the parameters correctly before the start of the process, including the processing temperature, temperature ramp, hold segments, processing time (time to stop heating). The program is redesigned and changed by setting and changing the processing temperature. Therefore, the control plan for the processing temperature plays an important role in the programming.
Double Chamber Vacuum Brazing/Sealing Furnace for Semi-Conductor
Double Chamber Vacuum Brazing/Sealing Furnace for Semi-ConductorDouble Chamber Vacuum Brazing/Sealing Furnace for Semi-ConductorDouble Chamber Vacuum Brazing/Sealing Furnace for Semi-Conductor
Double Chamber Vacuum Brazing/Sealing Furnace for Semi-Conductor

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