8 Inches Semi-Automatic Single Spindle Dicing Saw Ds830

Product Description

6-inch Single-Axis Semi-Automatic Precision Dicing Saw

Features:

 Standardly equipped with image recognition automatic alignment function
 Optional non-contact height measurement function (NCS)
 Optional blade break detection function (BBD)
 Optional knife mark detection function
 Customizable modules according to customer requirements
 Enhanced automation level
The DS616 precision dicing saw is equipped with an imported 1.5kW high-speed spindle; θ-axis DD motor drive for improved angular accuracy, angular resolution, and worktable flatness; upgraded power distribution system with multiple optional functions according to customer needs

	DS623	DS616	DS613
Configuration
Workpiece size(mm)	φ160  150	φ160  150	φ160 150
Cut depth(mm)	≤4 or customized	≤4 or customized	≤4 or customized
Spindle
Revolution speed(rpm)	10000-50000	10000-50000	10000-50000
Rated output(kw)	1.5/1.8/2.4	1.5/1.8/2.4	1.5/1.8/2.4
X Axis
Cutting Range(mm)	170	170	170
Transfer speed(mm/s)	0.1-500	0.1-400	0.1-400
Y Axis
Cutting range(mm)	170	170	170
Motion resolution(mm)	0.0001	0.0001	0.0001
Position accuracy(mm)	≤0.002/5	≤0.003/5	≤0.003/5
Position accuracy full range(mm)	≤0.003 /170	≤0.005 /170	≤0.005 /170
Z Axis
Max stroke(mm)	30	30	30
Max blade OD(MM)	Φ58	Φ58	Φ58
Motion resolution	0.0001	0.0001	0.0001
Repeatability (mm)	0.001	0.001	0.001
Θ Axis
Rotation range (deg)	380	380	380
Specification
Power(KW)	3.0(Single phase,AC220V)	3.0(Single phase,AC220V)	3.0(Single phase,AC220V)
Air pressure (Mpa L/min))	0.6~0.8 Max consumption 220	0.6~0.8 Max consumption 220	0.6~0.8 Max consumption 220
Wheel coolant (Mpa L/min)	0.2~0.4 Max consumption 4	0.2~0.4 Max consumption 4	0.2~0.4 Max consumption 4
Spindle coolant(Mpa L/min)	0.2~0.4 Max consumption 1.5	0.2~0.4 Max consumption 1.5	0.2~0.4 Max consumption 1.5
Duct (m3/min)	1.5	1.5	1.5
Dimension(W*D*H)mm	580*910*1650	580*910*1650	665*850*1650
Weight(kgs)	500	500	500

Application Areas:

 Diodes, transistors, MEMS, ICs, LEDs, NTCs, photovoltaics, medical devices, scintillation crystals, optics

Precision Cuttable Materials:

Silicon wafers, gallium arsenide, lithium niobate, alumina, ceramics, glass, quartz, sapphire, crystals, PCBs

Automatic Alignment Function:

Utilizing image pattern recognition technology, by referencing pre-registered position calibration data, it first identifies the mark on the workpiece, then aligns the target and adjusts the angle, ultimately calculating the position of the cutting path.