8 Inches Fully Automatic Wafer Grinder Dfg8560

• Customization: Available
• Type: Disc Grinder
• Power Source: Electricity
• Model NO.: HG5260
• Object: Saw Blade
• Application: Semi-Conductor
• Disc(Wheel) Type: Grinding Disc
• Material: Aluminum Alloy
• Working Style: High-speed universal
• Disc Diameter: 8 Inches
• Variable Speed: With Variable Speed
• Weight: 5000kgs
• Wokpiece Size: 8 Inches 12 Inches
• Power(kVA): 18kVA(Three Phase,200V)
• Air Pressure: 0.5-0.8 Max
• Wheel Coolant: 0.3-0.4max
• Transport Package: Standard Export Wooden Case
• Specification: 1400x3300x1800
• Trademark: OEM
• Origin: China
• HS Code: 8486102000
• Production Capacity: 500PCS/PC/Year

Product Description

Fully automatic wafer grinder HG5260

HG5260 wafer grinder is a fully automatic thinning machine with two spindles and three chuck tables, automatic wafer pick, loading/unload ing, equipped with a high rigidity air bearing grind spindle, a four-axis clean room robot arm, and a large-range high-resolution thickness gauge, etc. The machine is compatible with the thinning of 8/12inch wafers and realizes automatic wafer size switching without hardware replacement.

Features:

1. Large dimension movement with reliable running stability
2. 15 inches high sensitivity LCD screen, user friendly GUI
3. High power, high rigidity spindle, low vibration, rotation speed range 1000-4000rpm
4. High precision thickness guage, measuring range of 0-2.4mm, with resolution 0.1um,Repeatablity: ±0.5um
5. Min wafer thickness grind to 100um, back side TTV≤3um atfer grinding, Surface roughness Ra≤0.02um (#2000 grinding wheel)
6. Automatic 4-axes wafer pick robot arm for clean room
7. Strong two-fluid cleaning technology for wafer backside
8. IPC bus control mode, faster response time, more scalable ability
9. Portable HMI operating handle for easy machine operation and maintenance
10. Z1 grinding line designed overlap with Z2,improving backside grinding pattern quality, and stability
11. Automatic adjustment of TTV on the grinded wafer surface

12. Configuration:
    Work piece size(inch)	8/12 inches
    Z Axis
    Stroke(mm)	120
    In-feed speed (mm/s)	0.0001-0.080
    Min index resolution(mm)	0.1
    Utilities
    Power(kVA)	18KVA(three phase,200V)
    Air pressure(MPa L/min)	0.5~0.8Max consumption≥400
    Wheel coolant(MPa L/min)	0.3~0.4Max consumption≥25
    Spindle coolant(MPa L/min)	0.3~0.4Max consumption≥6.0
    Duct(m3/min)	≥4.0
    Foot print W*D*H(mm)	1400*3300*1800
    Weight(kg)	5000