Semi- automatic wafer grinder 5140
HG5140 wafer grinder is a semi-automatic thinning machine with single grind spindle and single chuck, manual wafer loading/un loading, The machine is compatible with the thinning of 4/8inch wafers and features in compact design, small footprint, high reliability, can support multiple wafers thinning at the same time, is suitable for processing resin material substrate and SiC, etc
Features
- 15 inches high sensitivity LCD screen, user friendly GUI
- High power, high rigidity spindle, low vibration, rotation speed range 1000-6000rpm
- High precision thickness guage, measuring range of 0-2.4mm, with resolution 0.1um, Repeatability: ±0.5um
- IPC bus control mode, faster response time, more scalable ability
- Min wafer thickness grind to 100um, back side TTV≤3um after grinding, Surface roughness Ra≤0.02um (#2000 grinding wheel)
| Configuration: |
|
| Work piece size(inch) |
4/5/6/8 |
| Z Axis |
|
| Stroke(mm) |
120 |
| In-feed speed (mm/s) |
0.0001-0.080 |
| Min index resolution(mm) |
0.1 |
| Utilities |
|
| Power(kVA) |
13KVA(three phase,380V) |
| Air pressure(MPa L/min) |
0.5~0.8Max consumption≥150 |
| Wheel coolant(MPa L/min) |
0.3~0.4Max consumption≥20 |
| Spindle coolant(MPa L/min) |
0.3~0.4Max consumption≥3.0 |
| Duct(m3/min) |
≥4.0 |
| Foot print W*D*H(mm) |
700*1890*1750 |
| Weight(kg) |
1500 |
Audited Supplier 
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